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Case Study

Contract Mixing of Conductive Epoxy for Electronics Manufacturing

Electronics / Semiconductor Equipment

A specialized mixing process was developed to maintain uniform particle distribution within the epoxy matrix, preserving the conductive performance critical to electronics assembly.

Contract Mixing of Conductive Epoxy for Electronics Manufacturing

Challenge

A manufacturer of electronic sensing equipment used a conductive epoxy containing silver particles to create electrical connections between components.

Conductive adhesives require extremely uniform particle distribution to maintain electrical conductivity. If particles settle or agglomerate during mixing or packaging, electrical performance can vary significantly.

The customer’s internal mixing process produced inconsistent dispersion of conductive particles, occasionally causing variability in electrical resistance across assembled components.

Solution

Altaris Industrial developed a mixing process designed to maintain uniform particle distribution within the epoxy matrix. The process included:

  • controlled shear mixing to disperse conductive particles
  • vacuum degassing to remove entrapped air
  • controlled transfer to packaging equipment

The epoxy was packaged into small-volume dispensing syringes suitable for precision assembly processes.

Results

  • improved electrical conductivity consistency between batches
  • elimination of air bubbles that could interrupt conductive pathways
  • stable supply of ready-to-use conductive adhesive
  • improved yield during electronic component assembly
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